Armstrong Fluid Technology announced the availability of six new Design Envelope pump models engineered specifically for low-flow, high-head applications.
The old message from some allegedly distressed person in a far-flung country asking you to wire them a sum of cash to get them out of trouble. Or the one where they found some long-lost dough that has my name written on it, but first I have to send them my bank-account information.
The inaugural event is scheduled for April 30-May 2, in Rosemont, Illinois, and will showcase the latest design and building processes, products and emerging technologies.